Method of depositing emulsified solids



, japan because the Patented Aug. 13, 1929.

UNITED STATES PATENT OFFICE.

HARRY OHISLET, OF BCHEHECTLDY, NEW YORK, ASSIGNOB TO GHIEBAL ELECTRIC 00mm, A CORPORATION 01 NEW YORK.

IE'IHOD O1 DEPOSITIHG EIULSII'IED SOLIDS.

In Drawing.

The present invention comprises a method of depositing the disperse phase of an emulsion on the surface of a solid, and it is of particular utility forthe coating of metal 5 or other objects with water japan, whichis an aqueous coating material described in U. S. Patent #1,294,422, issued to Wheeler P. Davey on February 18, 1919.

Heretofore, the coating of solids with water japan has been carried out for commeremulsified articles of 'a an-formin mate- 16 J P g rials out o the water and depositing them upon an electrode. Ordinary methods of applying paint, such as brushing, cannot be used advantageously in the case of water jgpan is too dilute to get a practical coating these methods.

In accordance wit my invention, I have provided a method of depositing emsulified material on a solid whereby coagulation of 7 the emulsified material (the disperse phase) is produced by an electrolyte and the coagulated material is caused to adhere to the solid surface.

In carrying. out my invention, the surface to be coated with japan is provided with a surface film of electrolyte. Preferably an electrolyte in solution is applied which will remain onthe surface as a solid upon evaporation of the solvent. For example, the object to'be coated may be dipped into an aqueous solution of an alkali, such as sodium or potassium hydroxide. A solutionihaving a concentration of one-half to two per cent of alkali is satisfactory. The object is dried,

40 leaving a thin film ofalkali on its surface.

The coated object then is dipped into the emulsion, and the alkali causes the deposition of a layer of the emulsion by the coagu- Applloatlon fled August 16, 1928. Serial In. 128,647.

lation of the disperse phase adjacent the film coated surface. The coagulated material forms an adherent layer on the surface of the ob'ect. Upon withdrawal of the object the ayer isbaked on as described in the above prior patent. Diffusion of the alkali which goes into solution in the waterforming the dispersion medium does no harm. Other electrol tes such as various salts, for example, so ium chloride, may be used, but an alkali is preferred.- The chief advantage of the present method is its cheapness and the ease with which it can be employed under circumstances which make it impracticable to use the special equipment required for the other methods.

What I claim as new and desire to secure by Letters Patent of the UnitedStates, is: 1. The method of coating an object with japan from an emulsion of japan and water i which consists in dippin the object to be coated into a solution 0 alkali, dryin to remove the solvent, leaving a film of a kali I and thereupon dipping said filmed object into said emulsion.

2. The method of depositing a thin layer of japan on an object which consists in depositing a film of an electrolyte on the surface of an object, immersing the coated surface in an emulsion in water of japan-forming materialsfor a suflicient length of time to cause a deposition of a portion of said materials as an adherent layer on said surface,-

and u on removal baking said layer.

3. he method of depositing japan from an aqueous emulsion on the surface of an object whichconsists in coating said object with a film of dry electrolyte, and bringin said filmed surface into contact with sai emulsion. p I

In witness whereof, I have hereunto set my-hand this 13th do of August 1926. 

